From raw silicon
to shipped package.
Orion Semiconductor Group manages the complete journey — supply chain sourcing, wafer fabrication support, OSAT assembly, advanced ATMP packaging, and final test — under one accountable roof.
Four pillars, one partner.
From the moment silicon leaves a foundry to the moment a finished device enters your supply stream, Orion owns accountability at every node.
The anatomy of a
resilient supply chain.
Every node in our chain is audited, dual-sourced where possible, and instrumented for real-time visibility — so disruptions stay invisible to your production line.
annually across OSAT network
supply chain footprint
12-month rolling average
in volume production
OSAT & ATMP — what this means
for your program.
Two disciplines, tightly integrated. OSAT covers conventional assembly and test at scale; ATMP pushes into chiplet, heterogeneous, and advanced 3D architecture territory.
OSAT — Outsourced Semiconductor Assembly and Test — is the discipline of taking a singulated die off a diced wafer and transforming it into a shippable, tested package. Orion manages six assembly lines across Malaysia, Philippines, and Thailand.
Our operations handle every conventional package format in high volume, with dedicated automotive-qualified lines running zero-defect production under IATF 16949 certification.
ATMP — Advanced Test, Measurement & Packaging — is where conventional OSAT ends and heterogeneous integration begins. It covers 2.5D silicon interposers, 3D die stacking with TSVs, fan-out wafer-level packaging, and chiplet co-design.
Orion's ATMP division is co-located with R&D engineering teams in Singapore and Taiwan to support early-stage package architecture decisions before tapeout.
Final test is the last line of defense before your device reaches the field. Orion's test engineering team handles ATE programming, loadboard design, handler configuration, and statistical yield analysis — closing the loop back to assembly and fab.
We support digital, mixed-signal, RF, power, and high-speed serial test on both Teradyne and Advantest platforms, with capacity for automotive burn-in and reliability screening.
On the ground where
silicon moves.
Six manufacturing regions, three bonded hubs, and regional engineering centers positioned to align with the world's foundry and assembly clusters.
Your next tapeout
deserves a full-chain partner.
Tell us your program requirements — package type, node, volume, timeline — and our applications team will respond within one business day with a capability match and indicative lead time.
From raw silicon
to shipped package.
Orion Semiconductor Group manages the complete journey — supply chain sourcing, wafer fabrication support, OSAT assembly, advanced ATMP packaging, and final test — under one accountable roof.
Four pillars, one partner.
From the moment silicon leaves a foundry to the moment a finished device enters your supply stream, Orion owns accountability at every node.
The anatomy of a
resilient supply chain.
Every node in our chain is audited, dual-sourced where possible, and instrumented for real-time visibility — so disruptions stay invisible to your production line.
annually across OSAT network
supply chain footprint
12-month rolling average
in volume production
OSAT & ATMP — what this means
for your program.
Two disciplines, tightly integrated. OSAT covers conventional assembly and test at scale; ATMP pushes into chiplet, heterogeneous, and advanced 3D architecture territory.
OSAT — Outsourced Semiconductor Assembly and Test — is the discipline of taking a singulated die off a diced wafer and transforming it into a shippable, tested package. Orion manages six assembly lines across Malaysia, Philippines, and Thailand.
Our operations handle every conventional package format in high volume, with dedicated automotive-qualified lines running zero-defect production under IATF 16949 certification.
ATMP — Advanced Test, Measurement & Packaging — is where conventional OSAT ends and heterogeneous integration begins. It covers 2.5D silicon interposers, 3D die stacking with TSVs, fan-out wafer-level packaging, and chiplet co-design.
Orion's ATMP division is co-located with R&D engineering teams in Singapore and Taiwan to support early-stage package architecture decisions before tapeout.
Final test is the last line of defense before your device reaches the field. Orion's test engineering team handles ATE programming, loadboard design, handler configuration, and statistical yield analysis — closing the loop back to assembly and fab.
We support digital, mixed-signal, RF, power, and high-speed serial test on both Teradyne and Advantest platforms, with capacity for automotive burn-in and reliability screening.
On the ground where
silicon moves.
Six manufacturing regions, three bonded hubs, and regional engineering centers positioned to align with the world's foundry and assembly clusters.
Your next tapeout
deserves a full-chain partner.
Tell us your program requirements — package type, node, volume, timeline — and our applications team will respond within one business day with a capability match and indicative lead time.